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Gigabyte GPU ai Servers TO86-SD1-AA05 HGX B200 NVL8 180GB Air-Cooled (8) Intel Granite Rapids SP (2) ai GPU server - Image 1

Gigabyte GPU ai Servers TO86-SD1-AA05 HGX B200 NVL8 180GB Air-Cooled (8) Intel Granite Rapids SP (2) ai GPU server - Image 2

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Gigabyte GPU ai Servers TO86-SD1-AA05 HGX B200 NVL8 180GB Air-Cooled (8) Intel Granite Rapids SP (2) ai GPU server

TO86-SD1-AA05

ORV3 GPU Server – Intel^® Xeon^® 6700/6500-Series Processors – 8OU DP NVIDIA HGX^™ B200

NVIDIA HGX^™ B200
1.8 TB/s GPU-to-GPU bandwidth with NVIDIA NVLink^™ and NVLink^™ Switch
Dual Intel^® Xeon^® 6700/6500-Series Processors
8-Channel DDR5 RDIMM / MRDIMM, 32 x DIMMs
Compatible with NVIDIA^® BlueField^®-3 DPUs and NVIDIA ConnectX^®-7 NICs
2 x 10 Gb/s LAN ports via Intel^® X710-AT2
1 x M.2 PCIe Gen5 x4
8 x 2.5″ Gen5 NVMe hot-swap bays
12 x FHHL PCIe Gen5 x16
48 V to 54 V DC Bus Bar power solution

Ordering Numbers: 6NTO86SD1UR000AA05*

Original price was: $469,900.00.Current price is: $399,900.00.

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Features & Compatibility

Boosting Individual Applications with On-Point Features

Intel^® Xeon^® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it’s high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

Core Technology Aligned with Aspirations

Acceleratorsbuilt-in*

Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators

8 or 12Channels

Increased memory frequency and throughput with DDR5 RDIMM support

PCIe 5.0lanes

Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators

CXL 2.0support**

Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region

Up to 288E-cores per CPU

Core dense and optimized efficiency for cloud-native and hyperscale workloads

Intel Xeon 6 Processors with E-cores

Up to 128P-cores per CPU

Greater core performance with improved TCO, accelerating AI and compute intensive workloads

MRDIMMsupport

Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level

Intel Xeon 6 Processors with P-cores

* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel’s official website or contact technical support for details.

** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.

Select GIGABYTE for the latest Gen Intel Xeon Platform

High CPU Performance

The best in computational performance relies on a system well designed by our engineers to adequately dissipate heat to achieve peak performance.

Energy Efficiency

Our engineers have baked in features to achieve higher efficiency from power supplies and server fans. Along with Titanium and Platinum offerings.

Optimal Price

GIGABYTE releases multiple product models and configurations to target exactly what users want without paying for extra features that go unused.

Ease of Administration

GIGABYTE servers come with GIGABYTE Management Console for server management. Using a web based browser remotely is key to easing management.

Continuous Operation

Systems are rigorously designed and tested to ensure downtime will not occur. Customers have come to expect stable performance.

TO86-SD1-AA05 Product Overview

TO86-SD1-AA05 BlockDiagram

High Performance

Supports NVIDIA HGX™ B200

The NVIDIA HGX™ B200 propels the data center into a new era of accelerating computing and generative AI, integrating NVIDIA Blackwell Tensor Core GPUs with a high-speed interconnect to accelerate AI performance at scale. Configurations of eight GPUs deliver unparalleled generative AI acceleration alongside a remarkable 1.4 TB of GPU memory and 64 TB/s of memory bandwidth for 15X faster real-time trillion-parameter-model inference, 12X lower cost, and 12X less energy. This extraordinary combination positions HGX B200 as a premier accelerated x86 scale-up platform designed for the most demanding generative AI, data analytics, and HPC workloads. HGX B200 supports advanced networking options—at speeds up to 400 Gb/s—delivering the highest AI performance with NVIDIA Quantum-2 InfiniBand and the Spectrum™-X Ethernet platform. HGX B200 with NVIDIA^® BlueField^®-3 DPUs enable cloud networking, composable storage, zero-trust security, and GPU compute elasticity in hyperscale AI clouds.

Empowering Innovation, Built for Open ComputeGIGABYTE OCP ORV3 Compliant Solutions

GIGABTYE is an active member of the OCP, regularly attending the OCP’s annual summits and continuously designing and releasing new compute, storage and GPU server hardware based on the OCP Open Rack Standard specifications and providing the best performing mezzanine cards for your OCP solution. GIGABYTE’s latest OCP server product line is based on OCP Open Rack V3 specification. The products are designed for a OCP rack and feature a separate PSU system, with power supplied to each server node by a bus-bar system running along the rear of the rack.

Add-on Card

GPU Server

Compute Node

Node Tray

JBOD

OCP Rack

GIGABYTE OCP ORV3 Compliant Solutions Advantages

Efficient Rack Density

Optimal design (2OU 2nodes / 2OU 3nodes) – balanced consideration between density and power consumption.

Thermal Optimization

Best thermal consideration to develop Rack and Nodes based on Cold Aisle/Hot Aisle concept.
Reduce power consumption of cooling.

Greater Power Efficiency

Low PUE helps reduce data center operating expense.
Central power shelf design to enhance power efficiency and optimize power consumption.

Easy Maintenance

Easier maintenance in front cold aisle instead of hot aisle.
Tool-less design for easy replacement and repair.
Less PSU quantities in whole rack to minimize maintenance efforts.

Higher MTBF

Centralizing power supplies and removing unnecessary components to enhance MTBF (Mean Time Between Failures).
Avoids system downtime caused by component failure and minimizes maintenance efforts.

Dimensions (WxHxD, mm)

8OU
537 x 380.5 x 853

Motherboard

MSJ4-GD0

CPU

Intel^® Xeon^® 6 Processors
– Intel^® Xeon^® 6700-Series Processors
– Intel^® Xeon^® 6500-Series Processors

Dual processor, TDP up to 350 W

^[Note]If only 1 CPU is installed, some PCIe or memory functions might be unavailable.

Socket

2 x LGA 4710
Socket E2

Chipset

System on Chip

Memory

32 x DIMM slots
Support DDR5 RDIMM/MRDIMM^[1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s

^[1]MRDIMMs are supported only on select Intel^® Xeon^® 6 processors with P-cores and only in a 1DPC configuration.

LAN

Front (I/O board):
2 x 10 Gb/s LAN (1 x Intel^® X710-AT2)
– Support NCSI function

1 x 10/100/1000 Mb/s Management LAN

Video

Integrated in ASPEED^® AST2600
– 1 x Mini-DP

Storage

Front hot-swap:
8 x 2.5″ Gen5 NVMe
– (NVMe from PEX89104)

Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1

Modular GPU

NVIDIA HGX^™ B200 with 8 x SXM GPUs

PCIe Expansion Slots

8 x FHHL x16 (Gen5 x16), from PEX89104
4 x FHHL x16 (Gen5 x16), from PEX89048

Front I/O

I/O board:
1 x USB 3.2 Gen1 port (Type-C)
1 x Micro USB port for BMC UART
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x System status LED

Security Modules

1 x TPM header with SPI interface
– Optional TPM 2.0 kit: CTM010

1 x PRoT connector (only enabled on RoT SKU)

System Fans

Motherboard:
4 x 92x92x38mm

GPU tray:
12 x 92x92x76mm

Operating Properties

Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

Packaging Dimensions

1300 x 800 x 650 mm

Packaging Content

1 x TO86-SD1-AA05
2 x CPU heatsinks
4 x Carriers

Part Numbers

– Barebone with NVIDIA module: 6NTO86SD1UR000AA05*
– Motherboard: 9MSJ4GD0DR-000*
– Backplane board – CBPG086: 9CBPG086NR-00*
– I/O board – COFP332: 9COFP332NR-00*

[#1] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#2] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#3] All trademarks and logos are the property of their respective owners.